Análise de falhas da caixa do trompete
  • 洋書

Análise de falhas da caixa do trompete  Paperback

Goyal, Deepak Kumar

  • ウェブストア価格 ¥7,536(本体¥6,851)
  • Edicoes Nosso Conhecimento(2024/07発売)
  • ポイント 68pt
  • オンデマンド(OD/POD)版です。キャンセルは承れません。
Comportamento de Erosão de Polpa de Aço de Turbina Revestido a Plasma
  • 洋書

Comportamento de Erosão de Polpa de Aço de Turbina Revestido a Plasma  Paperback

Singh, Harpeet/ Goyal, Deepak Kumar/ Goyal, Khushdeep

  • ウェブストア価格 ¥7,342(本体¥6,675)
  • Edicoes Nosso Conhecimento(2024/04発売)
  • ポイント 66pt
  • オンデマンド(OD/POD)版です。キャンセルは承れません。
A Textbook of Discrete Mathematics (2ND)
  • 洋書

A Textbook of Discrete Mathematics (2ND)  Paperback,  言語:ENG

Mittal, Harish/ Goyal, Vinay Kumar/ Goyal, Deepak Kumar

  • TechSar Pvt. Ltd(2023/06発売)
  • ご注文いただけません
The Illustrative Book of Cartilage Repair (2021)
  • 洋書

The Illustrative Book of Cartilage Repair (2021)  Hardcover,  言語:ENG

Goyal, Deepak Rajkumar (EDT)

  • ウェブストア価格 ¥50,685(本体¥46,078)
  • Springer Nature Switzerland AG(2020/10発売)
  • ポイント 460pt
  • 海外からお取り寄せ(通常6~9週間)
Engineering Interventions in Agricultural Processing (Innovations in Agricultural & Biological Engineering)
  • 洋書

Engineering Interventions in Agricultural Processing (Innovations in Agricultural & Biological Engineering)  Paperback,  言語:ENG

Goyal, Megh R. (EDT)/ Verma, Deepak Kumar (EDT)

  • ウェブストア価格 ¥20,071(本体¥18,247)
  • Apple Academic Press Inc.(2021/03発売)
  • ポイント 182pt
  • 海外からお取り寄せ(通常6~9週間)
3D Microelectronic Packaging : From Architectures to Applications (Springer Series in Advanced Microelectronics) (2ND)
  • 洋書

3D Microelectronic Packaging : From Architectures to Applications (Springer Series in Advanced Microelectronics) (2ND)  Paperback,  言語:ENG

Li, Yan (EDT)/ Goyal, Deepak (EDT)

  • ウェブストア価格 ¥40,548(本体¥36,862)
  • Springer Verlag, Singapore(2021/11発売)
  • ポイント 368pt
  • 海外からお取り寄せ(通常6~9週間)
Engineering Interventions in Foods and Plants (Innovations in Agricultural & Biological Engineering)
  • 洋書
  • 電子版あり

Engineering Interventions in Foods and Plants (Innovations in Agricultural & Biological Engineering)  Paperback,  言語:ENG

Verma, Deepak Kumar (EDT)/ Goyal, Megh R. (EDT)

  • ウェブストア価格 ¥20,071(本体¥18,247)
  • Apple Academic Press Inc.(2021/03発売)
  • ポイント 182pt
  • 海外取次在庫
3D Microelectronic Packaging : From Architectures to Applications (Springer Series in Advanced Microelectronics) (2ND)
  • 洋書

3D Microelectronic Packaging : From Architectures to Applications (Springer Series in Advanced Microelectronics) (2ND)  Hardcover,  言語:ENG

Li, Yan (EDT)/ Goyal, Deepak (EDT)

  • ウェブストア価格 ¥40,548(本体¥36,862)
  • Springer Verlag, Singapore(2020/11発売)
  • ポイント 368pt
  • 海外取次在庫
Engineering Interventions in Agricultural Processing (Innovations in Agricultural & Biological Engineering)
  • 洋書
  • 電子版あり

Engineering Interventions in Agricultural Processing (Innovations in Agricultural & Biological Engineering)  Hardcover,  言語:ENG

Goyal, Megh R. (EDT)/ Verma, Deepak Kumar (EDT)

  • ウェブストア価格 ¥33,453(本体¥30,412)
  • Apple Academic Press Inc.(2017/11発売)
  • ポイント 304pt
  • 海外からお取り寄せ(通常6~9週間)
3D Microelectronic Packaging : From Fundamentals to Applications (Springer Series in Advanced Microelectronics)
  • 洋書

3D Microelectronic Packaging : From Fundamentals to Applications (Springer Series in Advanced Microelectronics)  Paperback,  言語:ENG

Li, Yan (EDT)/ Goyal, Deepak (EDT)

  • ウェブストア価格 ¥40,548(本体¥36,862)
  • Springer International Publishing AG(2018/07発売)
  • ポイント 368pt
  • 海外取次在庫