Electronic Materials Innovations and Reliability in Advanced Memory Packaging

著者名：Gan, Chong Leong/Huang, Chen Yu

Springer（2025/07/21発売）

• 言語：ENG
• ISBN：9783031947940
• eISBN：9783031947957

Description

This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).

The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.

Table of Contents

Influences of Electronic Materials Properties on Packaging Reliability.- Mechanical and Thermal Stress of Encapsulant and New Materials in Memory Packaging.- Materials Development for Future Data Center Applications.- Advanced Chiplets and Heterogenous Integration in Memory Device Packaging.- Hybrid Bonding Device Packaging.- Hardware Reliability for Memory Modules and SSDs.- Innovative Sustainable Electronics Materials in Advanced Memory Packaging.- PCB and Substrate in Future Memory Applications.