Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS.The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components.Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.- Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques- Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs- Discusses properties, preparation, and growth of silicon crystals and wafers- Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures- Geared towards practical applications rather than theory
Table of Contents
Impact of Silicon MEMSSection I: Silicon as MEMS Material1. Properties of Silicon2. Czochralski Growth of SiliconCrystals3. Properties of Silicon Crystals4. Silicon Wafers: Preparation and Properties5. Epi Wafers: Preparation and Properties6. Thin Films on Silicon6.1 Thin films on Silicon: Silicon dioxide6.2 Thin films on Silicon: Silicon nitride6.3 Thin Films on Silicon: Poly-Si and SiGe6.4 Thin films on Silicon: AlD6.5 Thin Films on Silicon: Piezofilms6.6 Thin Films on Silicon: Metal films7. Thick-Film SOI Wafers: Preparation and PropertiesSection II: Modeling in MEMS 8. Multiscale Modeling Methods9. Mechanical Properties of Silicon Microstuctures10. Electrostatic and RF-properties of MEMS Structures11. Optical Modeling of MEMS12. Simulations of Etching Processes for MEMS Fabrication13. Gas Damping in Vibrating MEMS StructuresSection III: Measuring MEMS 14. Introduction to Measuring MEMS15. Silicon Wafer and Thin Film Measurements16. Optical Measurement of Static and Dynamic Displacement in MEMS17. MEMS Residual Stress Characterization: Methodology and Perspective18. Strength of Bonded Interfaces19. Oxygen and Bulk Microdefects in Silicon Section IV: Micromachining Technologies in MEMS20. MEMS Lithography21. Deep Reactive Ion Etching22. Wet Etching of Silicon23. Porous Silicon Based MEMS24. Surface Micromachining25. Vapour Phase Etch Processes for Silicon MEMS26. 2 3-D Printing for MEMS27. Microfluidics and Biomems in SiliconSection V: Encapsulation of MEMS Components28. Introduction to encapsulation of MEMS29. Silicon Direct Bonding30. Anodic Bonding31. Glass Frit Bonding32. Metallic Alloy Seal Bonding33. Bonding of CMOS Processed Wafers34. Wafer Bonding: Tools and Processes35. Encapsulation by Film Deposition36. Dicing of MEMS Devices37. 3D Integration of MEMS38. Via Technologies for MEMS39. Outgassing and Gettering40. Hermeticity Tests41. MEMS Reliability42. Appendix 1: Common Abbreviations and Acronyms43. Appendix 2: Nanoindentation Characterization of Silicon and other MEMS Materials
