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Full Description
This book captures the author's 35+ years of learning & experience in the semiconductor chip industry to provide a proven roadmap for successful, new product introduction process, tailored specifically to the semiconductor industry. The content includes a simplified process flow, success metrics, execution guidelines, checklists & calculators. The presentation is based on a product engineering centric "NPI hub" and the author guides readers through the complete process of semiconductor new product introduction, ensuring a successful plan execution.
Contents
Introduction.- Overall Picture of Product Development stages & where product engineers add value.- Get to know your products(s) intimately.- Put your reliability qualification plan & schedule together.- Put your characterization plans & schedule together.- Engineering Sample Phase.- Process Skew Lots (Assess Yield Variations, Yield pitfalls).- Assess your products' Reliability using industry standard specifications.- Analysis of failures to root cause is the key to a robust product.- Get ready for Production Silicon.- Compliance to Industry & Customer Standards.- Ring out the kinks in your manufacturing flow early.- Enable your manufacturing sites.- Start looking at cost reduction & manufacturing simplification.- Finance - Budgeting for char., rel. qual, boards etc.