Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
  • 洋書
  • 電子版あり

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)  Paperback,  言語:ENG

Zhang, Hengyun/ Che, Faxing/ Lin, Tingyu

  • ウェブストア価格 ¥47,977(本体¥43,616)
  • Woodhead Publishing Ltd(2019/11発売)
  • ポイント 436pt
  • 海外取次在庫