Reliability and Failure Analysis of High-Power LED Packaging

個数:1
紙書籍版価格
¥44,774
  • 電子書籍
  • ポイントキャンペーン

Reliability and Failure Analysis of High-Power LED Packaging

  • 著者名:Tan, Cher Ming/Singh, Preetpal
  • 価格 ¥37,778 (本体¥34,344)
  • Woodhead Publishing(2022/09/24発売)
  • 春分の日の三連休!Kinoppy 電子書籍・電子洋書 全点ポイント30倍キャンペーン(~3/22)
  • ポイント 10,290pt (実際に付与されるポイントはご注文内容確認画面でご確認下さい)
  • 言語:ENG
  • ISBN:9780128224083
  • eISBN:9780128224076

ファイル: /

Description

Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs.The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs.- Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them- Describes the chemistry underlying the material degradation and its impact on LEDs- Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs

Table of Contents

1. LED package materials2. LED failure mechanisms3. LED failure analysis techniques4. Effect of environment on LED lifetime and package reliability assessment5. Lumen recovery in high power LEDs under prolonged outdoor operation6. LED permanent degradation mechanisms under prolonged outdoor applications7. Effect of phosphors in LEDs and package degradation8. Blue vs White LED package degradation in LEDs under different conditions 9. LED package degradation in outdoor applications and its evolution with time10. Reliability tests for LEDs11. Conclusion and Future Work

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