Description
Handbook of Silicon Based MEMS Materials and Technologies, Third Edition is a comprehensive guide to MEMS materials, technologies, and manufacturing with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, modeling, manufacturing, processing, system integration, measurement, and materials characterization techniques of MEMS structures.The third edition of this book provides an important up-to-date overview of the current and emerging technologies in MEMS making it a key reference for MEMS professionals, engineers, and researchers alike, and at the same time an essential education material for undergraduate and graduate students.- Provides comprehensive overview of leading-edge MEMS manufacturing technologies through the supply chain from silicon ingot growth to device fabrication and integration with sensor/actuator controlling circuits- Explains the properties, manufacturing, processing, measuring and modeling methods of MEMS structures- Reviews the current and future options for hermetic encapsulation and introduces how to utilize wafer level packaging and 3D integration technologies for package cost reduction and performance improvements- Geared towards practical applications presenting several modern MEMS devices including inertial sensors, microphones, pressure sensors and micromirrors
Table of Contents
Part I1. Properties of silicon; Fracture toughness2. Czochralski Growth of Silicon Crystals3. Properties of Silicon Crystals4. Silicon Wafers: Preparation and Properties; Modern technologies 5. Epi Wafers: Preparation and Properties6. Thin Films on Silicon 7. Thick-Film SOI Wafers: Preparation and propertiesPart II8. Multiscale Modeling Methods9. Mechanical Properties of Silicon Microstructures10. Electrostatic and RF-Properties of MEMS Structures 11. Optical Modeling of MEMS12. Modeling of Silicon Etching13. Gas Damping in Vibrating MEMS Structures14. Recent Progress in Large-scale Electronic State Calculations and Data-driven SciencesPart III15. MEMS Lithography16. Deep Reactive Ion Etching; update17. Wet Etching of Silicon18. Porous Silicon Based MEMS19. Surface Micromachining20. Vapor Phase Etch Processes for Silicon MEMS21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS 22. Microfluidics and BioMEMS in SiliconPart IV23. Silicon Direct Bonding24. Anodic Bonding25. Glass Frit Bonding26. Metallic Alloy Seal Bonding27. Emerging Wafer Bonding Technologies28. Bonding of CMOS Processed Wafers29. Wafer-Bonding Equipment30. Encapsulation by Film Deposition31. Dicing of MEMS Devices32. 3D Integration of MEMS33. Own chapter for eWLP34. Through-Substrate Via Technologies for MEMS35. Outgassing and GetteringPart V36. Silicon Wafer and Thin Film Measurements37. Oxygen and Bulk Microdefects in Silicon38. Optical Measurement of Static and Dynamic Displacement in MEMS39. MEMS Residual Stress Characterization: Methodology and Perspective 40. Microscale deformation analysis41. Strength of Bonded Interfaces42. Hermeticity Tests43. MEMS testing and calibration44. MEMS ReliabilityPart VI45. Case Accelerometer46. Case Gyroscope47. Case Pressure Sensor48. Case Microphone49. Case Micromirror50. Case Optical MEMs
