Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures

個数:1
紙書籍版価格
¥12,310
  • 電子書籍
  • ポイントキャンペーン

Design and Test Strategies for 2D/3D Integration for NoC-based Multicore Architectures

  • 著者名:Manna, Kanchan/Mathew, Jimson
  • 価格 ¥10,117 (本体¥9,198)
  • Springer(2019/12/20発売)
  • 春分の日の三連休!Kinoppy 電子書籍・電子洋書 全点ポイント30倍キャンペーン(~3/22)
  • ポイント 2,730pt (実際に付与されるポイントはご注文内容確認画面でご確認下さい)
  • 言語:ENG
  • ISBN:9783030313098
  • eISBN:9783030313104

ファイル: /

Description

This book covers various aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.  It gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling for NoC-based multicores. The authors describe the use of the Integer Line Programming (ILP) technique for smaller benchmarks and a Particle Swarm Optimization (PSO) to get a near optimal mapping and test schedule for bigger benchmarks. The PSO-based approach is also augmented with several innovative techniques to get the best possible solution. The tradeoff between performance (communication or test time) of the system and thermal-safety is also discussed, based on designer specifications.  

  • Provides a single-source reference to design and test for circuit and system-level approaches to (NoC) based multicore systems;
  • Gives a complete account of the state-of-the-art and emerging techniques for near optimal mapping and test scheduling in (NoC) based multicore systems;
  • Organizes chapters systematically and hierarchically, rather than in an ad hoc manner, covering aspects of optimization in design and testing of Network-on-Chip (NoC) based multicore systems.


Table of Contents

Introduction to Network-on-Chip Designs and Tests.- Iterative Mapping with Through Silicon Via (TSV) placement for 3D-NoC-based multicore systems.- A constructive Heuristic for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Discrete Particle Swarm Optimization for integrated mapping and TSV Placement for 3D-NoC-based multicore systems.- Temperature-aware application mapping strategy for 2D-NoC-based multicore systems.- Temperature-aware design strategy for 3D-NoC-based multicore systems.- Temperature-aware test strategy for 2D as well as 3D-NoC-based multicore systems.

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