Advances in 3d Integrated Circuits and Systems (Series on Emerging Technologies in Circuits and Systems)

Yu, Hao/ Tan, Chuan Seng

World Scientific Publishing Co Pte Ltd（2015/10発売）

• 製本 Paperback:紙装版/ペーパーバック版／ページ数 392 p.
• 言語 ENG
• 商品コード 9789814699013
• DDC分類 621.3815

Full Description

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Contents

TSV and TSI Device Fabrication; Device Modeling; Macromodeling; Power and Thermal Integrity; Power Ground Design; Clock-Tree Design; 3D IC Test; Compressive Sensing and Data Recovery; Power and Thermal Modeling; Microfludic Based Thermal Management; Power I/O Management; Signal I/O Bandwidth Management; Q-Learning; Signal I/O Voltage-Swing Management; 3D Sensor Design; CMOS Readout Circuit; I/O Buffer Design; I/O with Clock-Data Recovery; Multi-Core Microprocessor Design; Non-Volatile Memory;