Embedded Dielectrics for Electronic Packaging (Wspc Series in Advanced Integration and Packaging)

Wong, Ching-ping/ Sun, Rong/ Yu, Shuhui

World Scientific Publishing Co Pte Ltd（2026/05発売）

• 製本 Hardcover:ハードカバー版／ページ数 300 p.
• 言語 ENG
• 商品コード 9789814619417

Full Description

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

Contents

Category and Function of Embedded Capacitors; Mixing Theories for Composites; Research and Products of Two Phase Ceramic/Polymer Percolative Materials; Modification of Polymer Matrix; Hybrid Filler Particles; Design of Embedded Devices and Elements Based on Dielectric Film; Voltage Switchable Dielectric;