Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Springer Theses)

Zhang, Qingke

Springer-Verlag Berlin and Heidelberg GmbH & Co. K（2015/11発売）

• 製本 Hardcover:ハードカバー版／ページ数 143 p.
• 言語 ENG
• 商品コード 9783662488218

Full Description

This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions.