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Description
Dielectric analysis of thermoset cure.- Epoxy-aromatic amine networks in the glassy state structure and properties.- Void growth and resin transport during processing of thermosetting - Matrix composites.- Physical aging in epoxy matrices and composites.- Curing mechanisms and mechanical properties of cured epoxy resins.
Contents
Dielectric analysis of thermoset cure.- Epoxy-aromatic amine networks in the glassy state structure and properties.- Void growth and resin transport during processing of thermosetting — Matrix composites.- Physical aging in epoxy matrices and composites.- Curing mechanisms and mechanical properties of cured epoxy resins.
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