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Full Description
The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.
Contents
Systems, vision and components in electronics assembly.- Manging automated electronics assembly.- PCB production equipment.- Modern platers and etchers.- Chemicals in PCB manufacturing.- Cleaning PCBs for higher quality.- Producing quality multilayer PCBs.- Plasma desmearing.- Chip-on-board technology.- Chip-and-wire technology.- TAB and flip-chip technology.- Component insertion equipment.- Workstations.- Automatic component insertion/placement systems.- Automated pin insertion.- Automated placement techniques.- Assembly challenges.- Robots in the electrical and electronics industry.- Consistency and quality using robots.- Robot hand exchangers.- Vision-guided assembly.- Vibratory insertion process: A new approach to non-standard component insertion.- SMT growth.- Realizing the benefits of SMT.- Designing reliability into surface-mount assemblies.- Design solutions.- Choosing SMT and setting up a facility.- SMT advantages.- Pick-and-place machines.- Surface-mount assembly using machine vision.- SMD placement using machine vision.- Hot-air leveling.- Testability circuit and board access problems.- Conductive epoxy for SMT solder replacement.- The removal and replacement of SMCs.- New applications.- New materials and equipment.- Integral substrate package technology.- Solder/cleaning, test and rework.- Solder joint acceptability.- Wave solder defects.- Soldering system trends.- Wave soldering: A study in process control.- Optimizing the wave soldering process.- Computerized soldering systems.- Re-examination of soldering techniques.- Adhesives for SMD wave soldering.- Adhesive evaluation.- Solder coating and leveling.- Screen printing.- Solvent flushing.- Rosin solder flux residues.- Aqueous cleaning.- Cleaning surface-mounted assemblies.- Desoldering components.- Bare-board testing.- Automatic optical inspection systems.- Machine vision.- Component testers and handlers.- Handlers.- Lead scanning.- Probe design and test fixturing.- Inspection equipment.- Image processing and non-destructive testing.- Design of SMA for testability.- Test and inspection of hybrid microcircuits.- In-circuit and functional ATE.- Functional test.- Test program development and processing power.- Robotic automated-test workcells.- Clean room technology.- Modular clean rooms.- Clean room air monitoring.- ESD control.- Static shielding techniques.- Computer control of modern factory operations.- Electronics CAE/CAD/CAM.- CAD/CAM for PCB manufacturing.- Designing PCBs for surface-mount assemblies.- CAD in hybrid production.- Discrete wired circuit board production.- Automating the assembly of electronic products.- Test, rework and inspection management costs.- Flexible manufacturing.- Computer simulation.- Local area networks.- Materials handling accessories.- Automated PCB handling.- Automated guided vehicle systems.- Batch-of-one assembly.- FMS for PCB assembly.- PCB assembly and test.- Factory control and robotic systems.- Authors' organizations and addresses.
