- ホーム
- > 洋書
- > ドイツ書
- > Mathematics, Sciences & Technology
- > Technology
- > electronics, electrical engineering, telecommunications
基本説明
Now available a softcover edition, this volume presents topical content from AMN, the only book series on microsystems technology, for practicing engineers as well as MSc and PhD students.
Full Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Contents
Evaluation of Mechanical Properties of MEMS Materials and Their Standardization
Elastoplastic Indentation Contact Mechanics of Homogeneous Materials and Coating-Substrate Systems
Thin film Characterization Using the Bulge Test
Uniaxial Tensile Test for MEMS Materials
On-chip Testing of MEMS
Reliability of a Capacitive Pressure Sensor
Inertial Sensors
High-Accuracy, High-Reliability MEMS Accelerometer Reliability of MEMS Variable Optical Attenuator
Reliability of MEMS Variable Optical Attenuator (pages 239-266)
Eco Scan MEMS Resonant Mirror
