基本説明
Two-volume reference detailing the accomplished developments, technologies and applications for three-dimensional electronic circuitry. Shows 3D solutions to the feature density problem.
Description
(Text)
Beiträge von Forschern und Strategen an Universitäten und aus der Industrie diskutieren hier die physikalischen Grenzen der klassischen 2D-Elektronik und beleuchten die Erfordernisse des Marktes sowie Ansatzpunkte für zukünftige Entwicklungen.
(Table of content)
INTRODUCTION TO 3D INTEGRATIONDRIVER FOR 3D INTEGRATION
Overview of 3D Processing Technology
Fabrication of Through Silicon Vias (TSV)
Fabrication, Processing and Singulation of Thin Wafers
Wafer and Die Bonding Technology
3D INTEGRATION PROCESSES
Universities and InstitutesStart Up Companies
3D Commerical Roadmaps
DESIGN FOR 3D INTEGRATION
NC State
Fraunhofer
U Minn
ELECTRICAL PERFORMANCE AND TEST OF 3D CIRCUITS
Electrical Performance - Infineon
Test of 3D Circuits - Intel
THERMAL MANAGEMANT
Fraunhofer IZM
IBM Zurich
APPLICATION OF 3D INTEGRATION
3D Integratio for Next Generation Microprocessors
3D Memories
Sensor Arrays
TSV for Power Devices
CONCLUSIONS
(Short description)
With contributions from key players in both academia and industry, this first encompassing treatise of this important field puts the known physical limitations for classic 2D electronics into perspective with the need for further electronics developments and market necessities.
(Text)
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.
(Author portrait)
Peter Ramm is head of the silicon technology department of the Fraunhofer Institute for Molecular Solid-State Technologies (EMFT) in Munich, Germany, where he is responsible for process integration of innovative devices and new materials. He received his Ph.D. in physics from the University of Regensburg and subsequently worked for Siemens before joining the Fraunhofer Institute for Solid State Technology (IFT) in Munich in 1988. He is the author or co-author of more than 50 papers and 20 patents.
