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基本説明
Ccover's exclusively the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices.
Full Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Contents
Introduction - Reliability Issues in MEMS Part I: Mechanical Reliability of MEMS Materials Mechanical Properties of MEMS Materials Micro/Nano-Indenters Bulge Methods Bending Test using Probe Tools Uni-axial Tensile Test with Specialized Chucking Methods On-chip Microstructures Part II: Reliability of MEMS Devices Pressure Sensors Inertial Sensors RF MEMS Optical MEMS
