Foundations of Heterogeneous Integration: an Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Yazdani, Farhang

Springer International Publishing AG（2018/03発売）

• 製本 Hardcover:ハードカバー版／ページ数 177 p.
• 言語 ENG
• 商品コード 9783319757674

Full Description

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.  Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively.  Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

Contents

Introduction.- Wirebond Physical Implementation.-  Flip-Chip Physical Implementation.- Substrate Physical Implementation.- Conventional Design Flow.-  Pathfinding and Co-Design.