Reliability and Yield in Nanoelectronics Manufacturing

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Reliability and Yield in Nanoelectronics Manufacturing

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  • 製本 Hardcover:ハードカバー版
  • 商品コード 9783032231895

Full Description

This book is a definitive guide to improving yield and reliability in the modern semiconductor industry. Blending academic research with industrial expertise, it unveils the innovative Build-In Reliability (BIR) platform.

The book consists of 20 chapters, organized into four technical parts, deep diving into operational excellence and future perspectives. It emphasizes BIR's core components—Wafer-Level Reliability (WLR) and the AI-enhanced Build-In Reliability Diagnosis System (BIRDS), a knowledge-based tool designed to enable early detection of non-conformance.

Part 1 introduces the BIR framework. Subsequent parts address completeness and timeliness, which are essential for establishing robust systems to enhance yield and reliability. Part 4 discusses emerging trends, including 3D packaging technologies (e.g., CoWoS), neural network-driven reliability predictions, Prognostic Health Management (PHM) for predictive maintenance, and the strategic importance of Diversity, Equity, and Inclusion (DEI) and globalization in overcoming industry challenges.

This book covers a wide range of topics, including logic devices (down to 2nm), volatile and non-volatile memory tests, laboratory management, tool design, integrated circuit (IC) qualification, supplier and consumables management, statistical process control (SPC), and a novel multi-level quality and reliability training and certification framework. It also addresses the development of highly reliable automotive chips, system-level lean methodologies, and optimization strategies, with a focus on yield-reliability and performance-cost trade-offs for value engineering.

Complex concepts are elucidated through 51 real-world case studies, derived from decades of industry experience. These case studies emphasize root cause analysis, timely corrective actions, and innovative methodologies. Vivid figures, flowcharts, and tables are used extensively to enhance clarity and minimize reliance on complex mathematics. Each part concludes with 20 key takeaways to reinforce core insights.

An indispensable resource for practitioners, researchers, and students, this book provides actionable strategies and advanced solutions for semiconductor manufacturing. It is the only comprehensive guide available today to bridge advanced academic research with real-world industrial applications in nanoelectronics manufacturing.

Contents

Part I. Build-In Reliability.- The IC Industry.- Quality & Reliability Activities in the IC Lifecycle.- The BIR Framework.- The Enriched BIR (eBIR).- Implementation of the BIR Framework.- Key Takeaways.- Part II. Completeness.- Team Players on Semiconductor Quality & Reliability.- Quality Engineering in Semiconductor Manufacturing.- Quality & Reliability Training.- Key Takeaways.- Part III. Timeliness.- Early Detections.- Baseline Management.- Using Wafer-Level Tests instead of PLR Tests.- IC Evaluations and Qualifications.- Key Takeaways.- Applying AI Techniques in Semiconductor Manufacturing.- Advanced Packaging.- Prognostics and Health Management.- DEI & Globalization.- Key Takeaways.- Appendix.- Index.