- ホーム
- > 洋書
- > ドイツ書
- > Mathematics, Sciences & Technology
- > Technology
- > electronics, electrical engineering, telecommunications
Full Description
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.
Presents novel techniques, tested with experiments on real hardware;
Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;
Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;
Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;
Includes coverage of resilient aspects of emerging applications such as IoT.
Contents
Introduction to Wearout.- Accelerated Self-Healing Techniques for BTI Wearout.- Accelerating and Activating Recovery for EM Wearout.- Circuit Techniques for Accelerated and Active Recovery.- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience.- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications.- Future Directions in Self-Healing.
