Packaging of High Power Semiconductor Lasers (Micro- and Opto-electronic Materials, Structures, and Systems)

Liu, Xingsheng/ Zhao, Wei/ Xiong, Lingling

Springer-Verlag New York Inc.（2016/10発売）

• 製本 Paperback:紙装版/ペーパーバック版／ページ数 402 p.
• 言語 ENG
• 商品コード 9781493955909
• DDC分類 621.366

Full Description

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Contents

Introduction of High Power Semiconductor Lasers.- Overview of High Power Semiconductor Laser Packages.- Thermal Design and Management in High Power Semiconductor Laser Packaging.- Thermal Stress in High Power Semiconductor Lasers.- Optical Design and Beam Shaping in High Power Semiconductor Lasers.- Materials and Components in High Power Semiconductor Laser Packaging.- Packaging Process of High Power Semiconductor Lasers.- Testing and Characterization of High Power Semiconductor Lasers.- Failure Analysis and Reliability Assessment in High Power Semiconductor Laser Packaging.- Applications of High Power Semiconductor Lasers.- Development Trend and Challenges in High Power Semiconductor Laser Packaging.