Three Dimensional System Integration : IC Stacking Process and Design （2011）

Papanikolaou, Antonis (EDT)/ Soudris, Dimitrios (EDT)/ Radojcic, Riko (EDT)

Springer-Verlag New York Inc.（2014/09発売）

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製本 Paperback:紙装版/ペーパーバック版／ページ数 246 p.
言語 ENG
商品コード 9781489981820
DDC分類 621.3815

Full Description

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.