高速回線におけるネットワーク配電<br>Power Distribution Networks in High Speed Integrated Circuits （2003. 304 p.）

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高速回線におけるネットワーク配電
Power Distribution Networks in High Speed Integrated Circuits （2003. 304 p.）

  • ウェブストア価格 ¥32,750（本体¥29,773）
  • SPRINGER NETHERLANDS（2003発売）
  • 外貨定価 US$ 169.99
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  • ポイント 594pt
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  • 製本 Hardcover:ハードカバー版／ページ数 304 p.
  • 言語 ENG
  • 商品コード 9781402075346

基本説明

The emphasis of the book is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.

Full Description

Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

Contents

1. Introduction.- 1.1 Evolution of integrated circuit technology.- 1.2 Evolution of design objectives.- 1.3 The problem of power distribution.- 1.4 Deleterious effects of power distribution noise.- 1.5 Book outline.- 2. Inductive Properties of Electric Circuits.- 2.1 Definitions of inductance.- 2.2 Variation of inductance with frequency.- 2.3 Inductive behavior of circuits.- 2.4 Inductive properties of on-chip interconnect.- 2.5 Summary.- 3. Properties of On-Chip Inductive Current Loops.- 3.1 Introduction.- 3.2 Dependence of inductance on line length.- 3.3 Inductive coupling between two parallel loop segments.- 3.4 Application to circuit analysis.- 3.5 Summary.- 4. Electromigration.- 4.1 Physical mechanism of electromigration.- 4.2 Electromigration-induced mechanical stress.- 4.3 Steady state limit of electromigration damage.- 4.4 Dependence of electromigration lifetime on the line dimensions.- 4.5 Statistical distribution of electromigration lifetime.- 4.6 Electromigration lifetime under AC current.- 4.7 Electromigration in novel interconnect technologies.- 4.8 Designing for electromigration reliability.- 4.9 Summary.- 5. High Performance Power Distribution Systems.- 5.1 Physical structure of a power distribution system.- 5.2 Circuit model of a power distribution system.- 5.3 Output impedance of a power distribution system.- 5.4 A power distribution system with a decoupling capacitor.- 5.5 Hierarchical placement of decoupling capacitance.- 5.6 Resonance in power distribution networks.- 5.7 Full impedance compensation.- 5.8 Case study.- 5.9 Design considerations.- 5.10 Limitations of the one-dimensional circuit model.- 5.11 Summary.- 6. On-Chip Power Distribution Networks.- 6.1 Styles of on-chip power distribution networks.- 6.2 Allocation of on-chip decoupling capacitance.- 6.3 Die-package interface.- 6.4 Other considerations.- 6.5 Summary.- 7. Computer-Aided Design and Analysis.- 7.1 Design flow for on-chip power distribution networks.- 7.2 Linear analysis of power distribution networks.- 7.3 Modeling power distribution networks.- 7.4 Characterizing the power current requirements of on-chip circuits.- 7.5 Numerical methods for analyzing power distribution networks.- 7.6 Summary.- 8. Inductive Properties of On-Chip Power Distribution Grids.- 8.1 Power transmission circuit.- 8.2 Simulation setup.- 8.3 Grid types.- 8.4 Inductance versus line width.- 8.5 Dependence of inductance on grid type.- 8.6 Dependence of Inductance on grid dimensions.- 8.7 Summary.- 9. Variation of Grid Inductance with Frequency.- 9.1 Analysis approach.- 9.2 Discussion of inductance variation.- 9.3 Summary.- 10. Inductance/Area/Resistance Tradeoffs.- 10.1 Inductance vs. resistance tradeoff under a constant grid area constraint.- 10.2 Inductance vs. area tradeoff under a constant grid resistance constraint.- 10.3 Summary.- 11. Scaling Trends Of On-Chip Power Distribution Noise.- 11.1 Prior work.- 11.2 Interconnect characteristics.- 11.3 Model of power supply noise.- 11.4 Power supply noise scaling.- 11.5 Implications of noise scaling.- 11.6 Summary.- 12. Impedance Characteristics of Multi-Layer Grids.- 12.1 Electrical properties of multi-layer grids.- 12.2 Case study of a two layer grid.- 12.3 Design implications.- 12.4 Summary.- 13. Inductive Effects In On-Chip Power Distribution Networks.- 13.1 Scaling effects in chip-package resonance.- 13.2 Propagation of power distribution noise.- 13.3 Local inductive behavior.- 13.4 Summary.- 14. Conclusions.- References.- About the Authors.