Stress-induced Phenomena in Metallization : Ninth International Workshop on Stress-induced Phenomena in Metallization (Aip Conference Proceedings / Materials Physics and Applications)

Ogawa, Shinichi (EDT)/ Ho, Paul S. (EDT)/ Zschech, Ehrenfried (EDT)

American Institute of Physics（2007/11発売）

• 製本 Hardcover:ハードカバー版／ページ数 212 p.
• 言語 ENG
• 商品コード 9780735404595

Full Description

The conference was on reliability related science in ULSI interconnect. Its main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips. All papers were peer reviewed.