Physical Design for 3D Integrated Circuits (Devices, Circuits, and Systems)

Todri-Sanial, Aida (EDT)/ Tan, Chuan Seng (EDT)

CRC Press（2021/03発売）

• 製本 Paperback:紙装版/ペーパーバック版／ページ数 416 p.
• 言語 ENG
• 商品コード 9780367778873
• DDC分類 621.3815

Full Description

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:


Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs

Supplies state-of-the-art solutions for challenges unique to 3D circuit design

Features contributions from renowned experts in their respective fields



Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Contents

2.5D/3D ICs: Drivers, Technology, Applications, and Outlook. Overview of Physical Design Issues for 3D-Integrated Circuits. Detailed Electrical and Reliability Study of Tapered TSVs. 3D Interconnect Extraction. 3D Placement and Routing. Power and Signal Integrity Challenges in 3D Systems-on-Chip. Design Methodology for TSV-Based 3D Clock Networks. Design Methodology for 3D Power Delivery Networks. Live Free or Die Hard: Design for Reliability in 3D Integrated Circuits. Thermal Modeling and Management for 3D Stacked Systems. Exploration of the Thermal Design Space in 3D Integrated Circuits. Dynamic Thermal Optimization for 3D Many-Core Systems. TSV-to-Device Noise Analysis and Mitigation Techniques. Overview of 3D CAD Design Tools. Design Challenges and Solutions for Monolithic 3D ICs. Design of High-Speed Interconnects for 3D/2.5D ICs without TSVs. Challenges and Future Directions of 3D Physical Design.