TSV 3D RF Integration : High Resistivity Si Interposer Technology

Ma, Shenglin/ Jin, Yufeng

Elsevier - Health Sciences Division（2022/04発売）

• 製本 Paperback:紙装版/ペーパーバック版／ページ数 292 p.
• 言語 ENG
• 商品コード 9780323996020
• DDC分類 621.3815

Full Description

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters.

A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology.

Contents

1. Introduction to HR-Si Interposer Technology
2. Design, process and electrical verification of HR-Si interposer
3. Design, verification and optimization of novel vertical RF transmission structure in HR-Si interposer
4. HR-Si TSV integrated inductor
5. Verification of 2.5D/3D heterogeneous RF integration of HR-Si interposer
6. 3D heterogeneous RF integration oriented HR-Si interposer embedded with microchannel
7. Patch Antenna in Stacked HR-Si interposers
8. Through Glass Via Technology
9. Conclusion and outlook