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Full Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices.
Contents
1. An Overview of Electronic Devices and Their Reliability2. Electronic Devices: Materials Properties Determine How They Operate and Are Fabricated3. Defects, Contamination and Yield4. The Mathematics of Failure and Reliability5. Mass Transport-Induced Failure6. Electronic Charge-Induced Damage7. Environmental Damage to Electronic Products8. Packaging Materials, Processes, and Stresses9. Degradation of Contacts and Packages10. Degradation and Failure of Electro-Optical and Magnetic Materials and Devices11. Characterization and Failure Analysis of Material, Devices and Packages12. Future Directions and Reliability Issues
