3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
  • 洋書

3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization  Hardcover

Bamberg, Lennart/ Joseph, Jan Moritz/ García-Ortiz, Alberto

  • ウェブストア価格 ¥27,270(本体¥24,791)
  • Springer Nature Switzerland AG(2022/06発売)
  • ポイント 247pt
  • 海外取次在庫
3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization
  • 洋書

3D Interconnect Architectures for Heterogeneous Technologies : Modeling and Optimization  Paperback,  言語:ENG

Bamberg, Lennart/ Joseph, Jan Moritz/ García-Ortiz, Alberto

  • ウェブストア価格 ¥27,270(本体¥24,791)
  • Springer Nature Switzerland AG(2023/06発売)
  • ポイント 247pt
  • 海外取次在庫