Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)
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  • 電子版あり
  • ポイントキャンペーン

Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)  Paperback,  言語:ENG

Zhang, Hengyun/ Che, Faxing/ Lin, Tingyu

  • ウェブストア価格 ¥48,307(本体¥43,916)
  • Woodhead Publishing Ltd(2019/11発売)
  • ポイント 2,195pt
  • 海外取次在庫