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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
  • 洋書

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)  Paperback,  言語：ENG

Cepeda-Rizo, Juan/ Gayle, Jeremiah/ Ravich, Joshua

  • ウェブストア価格 ¥13,527（本体¥12,298）
  • CRC Press（2024/08発売）
  • ポイント 122pt
  • 海外取次在庫
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
  • 洋書
  • 電子版あり

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)  Hardcover,  言語：ENG

Cepeda-Rizo, Juan/ Gayle, Jeremiah/ Ravich, Joshua

  • ウェブストア価格 ¥32,736（本体¥29,760）
  • CRC Press（2021/12発売）
  • ポイント 297pt
  • 海外取次在庫
1～2件／全2件
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