Stress Management for 3D ICS Using through Silicon Vias (Aip Conference Proceedings / Materials Physics and Applications) (2011)
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Stress Management for 3D ICS Using through Silicon Vias (Aip Conference Proceedings / Materials Physics and Applications) (2011)  Paperback,  言語:ENG

Zschech, Ehrenfried (EDT)/ Radojcic, Riko (EDT)/ Sukharev, Valeriy (EDT)

  • American Institute of Physics(2011/11発売)
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