Electromigration in Thin Films and Electronic Devices : Materials and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)
  • 洋書

Electromigration in Thin Films and Electronic Devices : Materials and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)  Paperback,  言語:ENG

Kim, Choong-Un (EDT)

  • ウェブストア価格 ¥55,651(本体¥50,592)
  • Woodhead Publishing Ltd(2016/08発売)
  • ポイント 505pt
  • オンデマンド(OD/POD)版です。キャンセルは承れません。
Electromigration in Thin Films and Electronic Devices : Materials and Reliability
  • 洋書
  • 電子版あり

Electromigration in Thin Films and Electronic Devices : Materials and Reliability  Hardcover,  言語:ENG

Kim, Choong-Un (EDT)

  • Woodhead Pub Ltd(2011/08発売)
  • ご注文いただけません
Fundamentals of Lead-free Solder Interconnect Technology : From Microstructures to Reliability
  • 洋書

Fundamentals of Lead-free Solder Interconnect Technology : From Microstructures to Reliability

Lee, Tae-kyu/Bieler, Thomas R./Kim, Choong-Un

  • Springer Verlag(2016/10発売)
  • ご注文いただけません