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Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components (Encyclopedia of Thermal Packaging)
  • 洋書

Encyclopedia of Thermal Packaging, Set 1: Thermal Packaging Techniques - Volume 3: Dielectric Liquid Cooling of Immersed Components (Encyclopedia of Thermal Packaging)  Hardcover,  言語：ENG

Geisler, Karl J L/ Bar-cohen, Avram (EDT)

  • ウェブストア価格 ¥71,187（本体¥64,716）
  • World Scientific Publishing Co Pte Ltd（2013/02発売）
  • ポイント 647pt
  • 海外からお取り寄せ（通常6～9週間）
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)
  • 洋書

Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥37,818（本体¥34,380）
  • World Scientific Publishing Co Pte Ltd（2014/10発売）
  • ポイント 343pt
  • 海外取次在庫
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)
  • 洋書

Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥109,006（本体¥99,097）
  • World Scientific Publishing Co Pte Ltd（2014/12発売）
  • ポイント 990pt
  • 海外取次在庫
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