Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science)
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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science)  Paperback,  言語:ENG

Madenci, Erdogan/ Guven, Ibrahim/ Kilic, Bahattin

  • ウェブストア価格 ¥41,674(本体¥37,886)
  • Springer-Verlag New York Inc.(2012/10発売)
  • ポイント 378pt
  • 海外取次在庫