信頼性物理学工学(テキスト・第3版)<br>Reliability Physics and Engineering〈3rd ed. 2019〉 : Time-To-Failure Modeling(3)

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  • 電子書籍

信頼性物理学工学(テキスト・第3版)
Reliability Physics and Engineering〈3rd ed. 2019〉 : Time-To-Failure Modeling(3)

  • 著者名:McPherson, J. W.
  • 価格 ¥18,147 (本体¥16,498)
  • Springer(2018/12/20発売)
  • ポイント 164pt (実際に付与されるポイントはご注文内容確認画面でご確認下さい)
  • 言語:ENG
  • ISBN:9783319936826
  • eISBN:9783319936833

ファイル: /

Description

This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.

Table of Contents

Introduction.- Physics of Degradation.- Time Dependence of Materials and Device Degradation.- From Material/Device Degradation to Time-To-Failure.- Time-To-Failure Modeling.- Gaussian Statistics - An Overview.- Time-To-Failure Statistics.- Failure Rate Modeling.- Accelerated Degradation.- Acceleration Factor Modeling.- Ramp-To-Failure Testing.- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits.- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering.- Conversion of Dynamical Stresses Into Effective Static Values.- Resonance and Resonance-Induced Degradation.- Increasing the Reliability of Device/Product Designs.- Screening.- Heat Generation and Dissipation.- Sampling Plans and Confidence Intervals.-