薄膜析出ハンドブック(第4版)<br>Handbook of Thin Film Deposition(4)

個数:1
紙書籍版価格
¥49,649
  • 電子書籍
  • ポイントキャンペーン

薄膜析出ハンドブック(第4版)
Handbook of Thin Film Deposition(4)

  • 著者名:Seshan, Krishna (EDT)/Schepis, Dominic (EDT)
  • 価格 ¥37,144 (本体¥33,768)
  • William Andrew(2018/02/23発売)
  • 冬の読書を楽しもう!Kinoppy 電子書籍・電子洋書 全点ポイント25倍キャンペーン(~1/25)
  • ポイント 8,425pt (実際に付与されるポイントはご注文内容確認画面でご確認下さい)
  • 言語:ENG
  • ISBN:9780128123119
  • eISBN:9780128123126

ファイル: /

Description

Handbook of Thin Film Deposition, Fourth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film micro properties, photovoltaic solar energy applications, materials for memory applications and methods for thin film optical processes. The book is broken up into three sections: scaling, equipment and processing, and applications. In this newly revised edition, the handbook will also explore the limits of thin film applications, most notably as they relate to applications in manufacturing, materials, design and reliability.- Offers a practical survey of thin film technologies aimed at engineers and managers involved in all stages of the process: design, fabrication, quality assurance, applications and the limitations faced by those processes- Covers core processes and applications in the semiconductor industry and new developments within the photovoltaic and optical thin film industries- Features a new chapter discussing Gates Dielectrics

Table of Contents

Section 1 - SCALING 1. A Perspective on Today's Scaling Challenges and Possible Future Direction 2. Limits and Hurdles To Continued Cmos Scaling 3. Reliability Issues: Reliability Imposed Limits to Scaling 4. Thermal Engineering at the Limits of the CMOS EraSection 2 - THIN FILM DEPOSITION EQUIPMENT AND PROCESSING 5. Limits Of Gate Dielectrics Scaling 6. Process Technology for Copper Interconnects 7. Sputter Processing 8. Thin Film Deposition for Front End of Line: The Effect of the Semiconductor Scaling, Strain Engineering and Pattern Effects 9. Equipment in CVD Processing 10. CMP Method and Practice 11. Atomic Layer Deposition: Fundamentals, Practice and Challenges 12. Optical Thin Films 13. Semiconductor Memory

最近チェックした商品