Description
Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors.
Table of Contents
Introduction to Abrasive ProcessesTribosystems of Abrasive Machining ProcessesKinematic Models of Abrasive ContactsContact MechanicsForces, Friction, and EnergyThermal Design of ProcessesMolecular Dynamics for Abrasive Process SimulationFluid DeliveryElectrolytic In-Process Dressing (ELID) Grinding and PolishingGrinding Wheel and Abrasive TopographyAbrasives and Abrasive ToolsConditioning of Abrasive WheelsLoose Abrasive ProcessesProcess Fluids for Abrasive MachiningTribology of Abrasive Machining Processed Materials
