Key enabling technologies for future wireless, wired, optical and satcom applications (River Publishers Series in Communications and Networking)

Debaillie, Björn (EDT)/ Ferrari, Philippe (EDT)/ Belot, Didier (EDT)

River Publishers（2024/11発売）

• 製本 Hardcover:ハードカバー版／ページ数 180 p.
• 言語 ENG
• 商品コード 9788770046657
• DDC分類 621.384

Full Description

This book presents the latest research roadmaps and achievements from the European ecosystem (industry, research, and academia) driving the development of future wireless, wired, optical and satcom applications utilising the mm-wave and sub-THz bands. It covers the entire value chain, including technologies, devices, characterisation, architectures, circuits, 3D heterogeneous integration and packaging.

As the interconnectedness of our world continues to expand, the importance of global innovation in communication systems and technologies grows significantly. The increasing reliance on digital communication necessitates systems that can manage higher data traffic, provide faster and more reliable connectivity, and sustainably support a diverse range of applications. Achieving these goals requires a shift towards higher frequency bands (mm-wave and sub-THz) and the adoption of disruptive technologies. Heterogeneous integration of (Bi)CMOS, SOI, and III/V components such as GaN or InP, along with advanced packaging techniques, is essential to realise ubiquitous, ultra-high bandwidth, and low latency networks. To ensure that future communication systems are not only technologically advanced but also sustainable and responsible, it is crucial to minimize their environmental impact by considering the materials used, manufacturing processes, operational efficiency, and recyclability.

The book captures the synergetic interactions between European Chips JU projects SHIFT and Move2THz, the European 3D heterogenous integration and packaging community and the MTT-TC9 society. These interactions were forged during the International Workshop on "Key Enabling Technologies for Future Wireless, Wired, Optical and Satcom Applications" at the European Microwave Week in Paris, France, on 22 September, 2024.

Whether you are a professional in the field or simply interested in the future of communication technologies, this book offers invaluable insights into the technological breakthroughs shaping our digital future.

The Open Access version of this book, available at http://www.taylorfrancis.com, has been made available under a Creative Commons Attribution-Non Commercial (CC-BY-NC) 4.0 license.

Contents

Preface  Editors' Biography  List of Contributors  List of Figures  List of Tables  1 B55X: A SHIFT in STMicroelectronics BiCMOS Technologies  2 RF Technology Roadmap for 5G and 6G RF Front-end Systems  3 Advanced Substrate Technologies for Sub-THz Era  4 A CMOS Compatible III-V-on-300 mm Si Technology for Future High-speed Communication Systems: Challenges and Possibilities  5 The Impact of Irradiation on DC Characteristics and
Low-Frequency Noise of Advanced SiGe:C HBTs  6 D-band Modulated Signal Generation using Photonics Techniques  7 Decarbonizing the Electronics Industry to Achieve Net Zero (2024)  8 Analog Multiplexing for Bandwidth and Sampling Rate Multiplication of Digital-Analog Converters in Coherent Optical Transmission Systems  9 Challenges for 2.5D and 3D Integration of InP HBT Technology  10 Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method  11 D-band Phased Array Antenna Module for 5G Backhaul  12 Sub-THz Transceiver Design for Future Generation Mobile Communications  13 Ka-Band GaN-on-SiC Power Amplifier for High EIRP Satellite Phased Antenna Array  14 InP on Si Technologies for Next-Generation Optical Communication High-speed Analog Front-Ends  15 150 nm Gallium Nitride on Silicon Carbide Technology for High-power 5G New Radio Applications  16 Post-process Substrate Porosification for RF Applications  17 A Multi-standard RF Bandpass Sigma-Delta ADC  18 D-band RF Architecture for Beyond 5G Wireless Networks: Specifications, Challenges, and Key Enabling Technologies  19 E-band and D-band VCOs: Distributed Tank Design Methodology, Bufferless Approach  20 2.5D, 3D Assembly Technologies for RF, mmW and Sub-THz Heterogeneous Systems  21 Heterointegration Approaches for InP-HBT Technologies for 5G Applications and Beyond  22 RF-Heterointegration at Wafer-level and Panel-level for mmWave Applications  23 SiGe BiCMOS & III-V Technologies Heterogeneous Integration Challenges  24 Advanced Packaging Solutions for mmWave Applications  25 Modular 3D mmW and THz Packaging Concepts and Technologies  26 LDS and AMP Processes for RF Antenna in Package (AiP) Applications in the E- and D-Bands  27 Sub-THz Antenna and Package Integration for Miniaturized Surface-Mount Device Modules  Index