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Full Description
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.
Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;
Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;
Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
Contents
Chapter 1: Silver Sintering and Soldering: Bonding Process and Comparison.- Chapter 2: Sintered Silver for LED Applications.- Chapter 3: Process Control of Sintered Ag Joint in Production for Die-Attach Applications.- Chapter 4: Thermomechanical Modeling of High-Temperature Bonded Interface Materials.- Chapter 5: Reliability and Failure Mechanisms of Sintered Ag as Die Attach Joint.- Chapter6: Morphological changes in sintered silver due to atomic migration.- Chapter 7: Doctrine of Equivalents and Sintered Silver (Ag) Paste as Bonding Materials.- Chapter 8: Sintered Copper : Chemistry, Process and Reliability.- Chapter 9: Transient Liquid Phase Bonding.- Chapter 10: Die attach materials for extreme conditions and harsh environments.
