Transmit Receive Modules for Radar and Communication Systems

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Transmit Receive Modules for Radar and Communication Systems

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  • 製本 Hardcover:ハードカバー版/ページ数 268 p.
  • 言語 ENG
  • 商品コード 9781608079797
  • DDC分類 621.3848

基本説明

This newly revised edition of the 2003 classic, this book serves as an up-to-date, practical reference for complete RFIC know-how. The second edition includes numerous updates, including greater coverage of CMOS PA design, RFIC design with on-chip components, and more worked examples with simulation results. By emphasizing working designs, this book practically transports you into the authors’ own RFIC lab so you can fully understand the function of each design detailed in this book. Among the RFIC designs examined are RF integrated LC-based filters, VCO automatic amplitude control loops, and fully integrated transformer-based circuits, as well as image reject mixers and power amplifiers.

Full Description

The use of electronically scanned phased arrays is increasing in systems such as radar, wireless networks, and satellite ground terminals. An important and necessary component for these systems is the transmit receive (T/R) module, which provides the amplification and electronic beam steering that is required for proper function. This new resource presents a comprehensive overview of all design, fabrication, integration, and implementation issues associated with T/R modules for radar and communications. This book provides engineers and researchers with practical designs and 44 examples of analysis, circuits, and components used in T/R modules. It also provides a solid explanation of the theory for how T/R modules operate and how they can be optimized. In addition, this book shows how the latest technical advances in silicon germanium (SiGe) and gallium nitride (GaN) are allowing levels of performance that were previously unachievable. The book concludes with informative chapters on testing, cost considerations, and the future of next generation T/R modules.

Contents

Phased Arrays in Radar and Communication Systems; Transmit/Receive Modules; Semiconductors For T/R Modules; Signal Integrity Issues In T/R Modules; Materials for T/R Modules; Heat Issues and Solutions For T/R Modules; MMIC Fabrication and T/R Module Manufacturing; Testing of MMICs and T/R Modules; MMIC and T/R Module Cost; Next Generation T/R Modules.

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