- ホーム
- > 洋書
- > 英文書
- > Science / Mathematics
基本説明
Covers mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment.
Full Description
A total revision of the author's previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book:Provides complete mathematical derivations and supplements formulae with design plotsOffers complete exercise solutions (Mathcad (TM) worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this bookAddresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conductionPresents mathematical descriptions of large thermal network problem formulationDiscusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problemsThis reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Contents
IntroductionPrimary mechanisms of heat flowConductionApplication example: Silicon chip resistance calculationConvectionApplication example: Chassis panel cooled by natural convectionRadiationApplication example: Chassis panel cooled only by radiation 7Illustrative example: Simple thermal network model for a heat sinked power transistorIllustrative example: Thermal network circuit for a printed circuit boardCompact component modelsIllustrative example: Pressure and thermal circuits for a forced air cooled enclosureIllustrative example: A single chip package on a printed circuit board-the problemIllustrative example: A single chip package on a printed circuit board-Fourier series solutionIllustrative example: A single chip package on a printed circuit board-thermal network solutionIllustrative example: A single chip package on a printed circuit board-finite element solutionIllustrative example: A single chip package on a printed circuit board-methods comparedThermodynamics of airflowThe first law of thermodynamicsHeat capacity at constant volumeHeat capacity at constant pressure Steady gas flow as an open, steady, single stream Air temperature rise: Temperature dependence Air temperature rise: T identified using differential forms of T, Q Air temperature rise: T identified as average bulk temperatureAirflow I: Forced flow in systemsPreliminaries Bernoulli's equation Bernoulli's equation with losses Fan testing Estimate of fan test error accrued by measurement of downstream static pressure Derivation of the "one velocity" head formula Fan and system matching Adding fans in series and parallel Airflow resistance: Common elements Airflow resistance: True circuit boards Modeled circuit board elements Combining airflow resistances Application example: Forced air cooled enclosure Airflow II: Forced flow in ducts, extrusions, and pin fin arrays The airflow problem for channels with a rectangular cross-section Entrance and exit effects for laminar and turbulent flow Friction coefficient for channel flow Application example: Two-sided extruded heat sink A pin fin correlation Application example: Pin fin problem from Khan, et al. Flow bypass effects according to LeeApplication example: Flow bypass method using Muzychka and Yovanovich correlationApplication example: Flow bypass method using HBT friction factor correlationFlow bypass effects according to Jonsson and MoshfeghApplication example: Pin fin problem using Jonsson and Moshfegh correlationAirflow III: Buoyancy driven draftDerivation of buoyancy driven headMatching buoyancy head to systemApplication example: Buoyancy-draft cooled enclosureSystem models with buoyant airflowForced convective heat transfer I: ComponentsForced convection from a surface The Nusselt and Prandtl numbers The Reynold's number Classical flat plate forced convection correlation: Uniform surface temperature, laminar flowEmpirical correction to classical flat plate forced convectioncorrelation, laminar flowApplication example: Winged aluminum heat sink Classical flat plate forced convection correlation: Uniform heat rate per unit area, laminar flowClassical flat plate (laminar) forced convection correlation extended to small Reynold's numberCircuit boards: Adiabatic heat transfer coefficients and adiabatic temperaturesAdiabatic heat transfer coefficient and temperature according to M. Faghri, et al.Adiabatic heat transfer coefficient and temperature according to R. Wirtz Application example: Circuit board with 1.5 in. / 1.5 in. / 0.6 in. convecting modulesApplication example: Circuit board with 0.82 in./ 0.24 in. /0.123 in. convecting modulesForced convective heat transfer II: Ducts, extrusions, and pin fin arraysBoundary layer considerationsA convection/conduction model for ducts and heat sinksConversion of an isothermal heat transfer coefficient referenced to inlet to referenced to local airNusselt number for fully developed laminar duct flow corrected for entry length effectsA newer Nusselt number for laminar flow in rectangular (cross-section) ductsNusselt number for turbulent duct flowApplication example: Two-sided extruded heat sinkFlow bypass effects according to Jonsson and MoshfeghApplication example: Heat sink in a circuit board channel using the flow bypass method of LeeIn-line and staggered pin fin heat sinksApplication example: Thermal resistance of a pin fin heat sink Natural convection heat transfer I: PlatesNusselt and Grashof numbersClassical flat plate correlationsSmall device flat plate correlationsApplication example: Vertical convecting plateApplication example: Vertical convecting and radiating plateVertical parallel plate correlations applicable to circuit board channelsApplication example: Vertical card assembly Recommended use of vertical channel models in sealed and vented enclosuresConversion of heat transfer coefficients referenced-to-inlet air to referenced-to-local airApplication example: Enclosure with circuit boards - enclosure temperatures onlyApplication example: Enclosure with circuit boards - circuit board temperatures onlyApplication example: Enclosure with circuit boards, comparison with CFDApplication example: Single circuit board enclosure with negligible circuit board radiationIllustrative example: Single circuit board enclosure with radiation exchange between interior enclosure walls and circuit board, results compared with experimentIllustrative example: Metal walled enclosure with ten circuit boardsIllustrative example: Metal walled enclosure with heat dissipation providedNatural convection heat transfer II: Heat sinksHeat sink geometry and some nomenclatureA rectangular U-channel correlation from Van de Pol and TierneyDesign plots representing the Van de Pol & Tierney correlationA few useful formulaeApplication example: Natural convection cooled, vertically oriented heat sinkApplication example: Natural convection cooled, nine fin heat sink compared to test dataThermal radiation heat transferBlackbody radiation Spacial effects and the view factor Application example: View factors for finite parallel plates Non-black surfaces The radiation heat transfer coefficient Application example: Radiation and natural convection cooled enclosure with circuit boardsRadiation for multiple gray-body surfaces Hottel script F (F) method for gray-body radiation exchange Application example: Gray-body circuit boards analyzed as infinite parallel platesApplication example: Gray-body circuit boards analyzed as finite parallel platesThermal radiation networksThermal radiation shielding for rectangular U-channels (fins)Application example: Natural convection and radiation cooled heat sinkApplication example: Nine fin heat sink, compared with test dataApplication example: Natural convection and radiation cooled nine fin heat sinkIllustrative example: Natural convection and radiation cooled heat sinkConduction I: Some basicsFourier's law of heat conductionApplication example: Mica insulator with thermal pasteThermal conduction resistance of some simple structuresThe one-dimensional differential equation for heat conductionApplication example: Aluminum core board with negligible air coolingApplication example: Aluminum core board with forced air coolingApplication example: Simple heat sinkFin efficiencyDifferential equations for more than one dimensionPhysics of thermal conductivity of solidsThermal conductivity of circuit boards (epoxy-glass laminates)Application example: Epoxy-glass circuit board with copperThermal interface resistanceApplication example: Contact resistance for an aluminum jointConduction II: Spreading resistanceThe spreading problemFixed spreading angle theoriesCircular-source, semi-infinite media solution by Carslaw and Jaeger (1986)Rectangular-source, time dependent, semi-infinite media solution by Joy & Schlig (1970)Other circular source solutionsRectangular source on rectangular, finite-media with one convecting surface: TheoryRectangular source on rectangular, finite-media: Design curvesApplication example: Heat source centered on a heat sink (Ellison, 2003)Application example: IC chip on an alumina substrateRectangular source on rectangular, finite-media with two convecting surfaces: TheoryExploring the difference between one-sided and two-sided Newtonian coolingIncluding the effect of two different ambients to the two-sided spreading theoryApplication example: Heat sink with two convecting sides, one finned and one flatSquare source on square, finite-media with one convecting surface - time dependent (Rhee and Bhatt, 2007)Additional mathematical methodsThermal networks: Steady-state theoryIllustrative example: A simple steady-state, thermal network problem, solutions comparedThermal networks: Time-dependent theoryIllustrative example: A simple time-dependent, thermal network problemFinite difference theory for conduction with Newtonian coolingProgramming the pressure/airflow network problemFinite element theory - the concept of the calculus of variationsFinite element theory - derivation of the one-dimensional Euler-Lagrange equationFinite element theory - application of the one-dimensional Euler-Lagrange equationFinite element theory - derivation of the two-dimensional Euler-Lagrange equationFinite element theory - application of the Euler-Lagrange equation to two dimensionsAppendicesBibliographyIndex
