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Full Description
The reference text focuses on covering advanced manufacturing processes to fabricate microfluidic and micro-electromechanical system devices. It covers the fabrication of multiple hole arrays for interconnects, surface roughening of glass for microsystems packaging applications, and fabrication, and characterization of through-glass via for micro-electromechanical system packaging applications.
This book:
Presents an overview of subtractive technologies needed to process glass materials for micro-fluidic, and micro-electromechanical system applications
Discusses the latest developments in advanced machining techniques based on mechanical energy, chemical energy, plasma energy, and high-temperature methods
Covers post-processing techniques employed to facilitate the machined glass substrates for the micro-electromechanical system, micro-fluidic, and lab-on-chip applications
Explains advanced techniques such as nonconventional machining processes, hybrid, and sequential machining methods to process glass
Illustrates topics such as photoacoustic biosensing, cantilever beam temperature sensor, and parametric effect on machined micro-channels
It is primarily written for senior undergraduates, graduate students, and academic researchers in the fields of manufacturing engineering, industrial engineering, mechanical engineering, production engineering, materials science, and engineering.
Contents
1. Introduction. Part 1: Mechanical Approaches. 2. Micro-Grinding Process of Glass Substrates. 3. Ultrasonic Machining of Glass Substrates. 4. Sandblasting of Glass Substrates. Part 2: Chemical Approaches. 5. Chemical Etching of Glass Substrates. 6. Fabrication of TGV's by ECDD process for MEMS packaging applications. 7. ECD milling of glass for micro fluidic and RDL applications. Part 3: Plasma Approach. 8. Reactive Ion Etching of Glass Substrates. Part 4: High Temperature Approaches. 9. Glass Reflow of Glass Substrates. 10. Microwave Machining of Glass Substrate for Micro Hole Fabrication. 11. Laser Machining of Glass Substrates. Part 5: Hybrid Approach. 12. Triplex hybrid method for glass processing: Laser and Ultrasonic assisted Electrochemical discharge machining. Part 6: Post Processing Approach. 13. Post processing of glass substrates for Micro-Fluidic and MEMS applications.14. Conclusions.
