マイクロエレクトロニクスおよびオプトエレクトロニクスの材料・構造（全２巻） Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Suhir, Ephraim; Lee, Y.C.; Wong, C.P. (Eds.)

Springer（2007/05発売）

• 製本 Hardcover:ハードカバー版／ページ数 1,460 p.
• 商品コード 9780387279749

基本説明

マイクロエレクトロニクスならびにオプトエレクトロニクスの材料・アセンブリ・構造・システムの物理学・力学・信頼性・パッケージングに関する最も包括的で、最も新しく、容易に応用できるレファレンス。電気工学、材料工学、機械工学、信頼性工学といった分野のエンジニアや応用物理学者・材料科学者向の自習用マニュアルとしても有用。
Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging.

Full Description

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging is the first comprehensive reference to collect and present the most, up-to-date, in-depth, practical and easy-to-use information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials, assemblies, structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices.   Furthermore,  practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design, manufacture and operate viable, reliable and cost-effective electronic components or photonic devices.  The emphasis is on the science and engineering of electronic and photonic packaging, on physical design problems, challenges and solutions.

Volume I focuses on physics and mechanics of micro- and opto-electronic structures and systems, i.e., on the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume II deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.