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Full Description
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands.
Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts.
Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
Contents
Image Processing and Computer Vision for MEMS Testing. Image Correlation Techniques for Microsystems Inspection. Light Scattering Techniques for the Inspection of Microcomponents and Microstructures. Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM). Optical Profiling Techniques for MEMS Measurement. Grid and Moiré Methods for Micromeasurements. Grating Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents. Interference Microscopy Techniques for Microsystem Characterization. Measuring MEMS in Motion by Laser Doppler Vibrometry. An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-Of-Plane Deformations of MEMS and MOEMS. Optoelectronic Holography for Testing Electronic Packaging and MEMS. Digital Holography and Its Application in MEMS/MOEMS Inspection. Speckle Metrology for Microsystem Inspection. Spectroscopic Techniques for MEMS Inspection. Index.
