Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices)
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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices)  Hardcover,  言語:ENG

Zhang, Shuye/ Sun, Guoli

  • ウェブストア価格 ¥28,089(本体¥25,536)
  • Institution of Engineering and Technology(2025/07発売)
  • ポイント 255pt
  • 海外取次在庫