MEMS Packaging (Wspc Series in Advanced Integration and Packaging)
  • 洋書

MEMS Packaging (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語:ENG

Lee, Yung-cheng (EDT)/ Cheng, Yu-ting (EDT)/ Ramadoss, Ramesh (EDT)

  • ウェブストア価格 ¥30,006(本体¥27,279)
  • World Scientific Publishing Co Pte Ltd(2018/02発売)
  • ポイント 272pt
  • 海外取次在庫