Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
  • 洋書

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs  Paperback,  言語:ENG

Noia, Brandon/ Chakrabarty, Krishnendu

  • Springer International Publishing AG(2016/08発売)
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