MEMS Packaging (Wspc Series in Advanced Integration and Packaging)
  • 洋書

MEMS Packaging (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語:ENG

Lee, Yung-cheng (EDT)/ Cheng, Yu-ting (EDT)/ Ramadoss, Ramesh (EDT)

  • ウェブストア価格 ¥30,006(本体¥27,279)
  • World Scientific Publishing Co Pte Ltd(2018/02発売)
  • ポイント 272pt
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Manufacturing Aspects in Electronic Packaging 1993 : Presented at the 1993 Asme Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 (Amd)
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Manufacturing Aspects in Electronic Packaging 1993 : Presented at the 1993 Asme Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993 (Amd)  Paperback,  言語:ENG

Lee, Yung-Cheng

  • American Society of Mechanical Engineers(1993/01発売)
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Intelligent Robotics and Applications : 6th International Conference, ICIRA 2013, Busan, South Korea, September 25-28, 2013, Proceedings, Part II (Lecture Notes in Computer Science) (2013)
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Intelligent Robotics and Applications : 6th International Conference, ICIRA 2013, Busan, South Korea, September 25-28, 2013, Proceedings, Part II (Lecture Notes in Computer Science) (2013)  Paperback,  言語:ENG

Lee, Jangmyung (EDT)/ Lee, Min Cheol (EDT)/ Liu, Honghai (EDT)

  • ウェブストア価格 ¥11,148(本体¥10,135)
  • Springer-Verlag Berlin and Heidelberg GmbH & Co. K(2013/09発売)
  • ポイント 101pt
  • 海外取次在庫
Intelligent Robotics and Applications : 6th International Conference, ICIRA 2013, Busan, South Korea, September 25-28, 2013, Proceedings, Part I (Lecture Notes in Computer Science) (2013)
  • 洋書

Intelligent Robotics and Applications : 6th International Conference, ICIRA 2013, Busan, South Korea, September 25-28, 2013, Proceedings, Part I (Lecture Notes in Computer Science) (2013)  Paperback,  言語:ENG

Lee, Jangmyung (EDT)/ Lee, Min Cheol (EDT)/ Liu, Honghai (EDT)

  • ウェブストア価格 ¥11,148(本体¥10,135)
  • Springer-Verlag Berlin and Heidelberg GmbH & Co. K(2013/09発売)
  • ポイント 101pt
  • 海外取次在庫