Multimodality in Architecture : Collaboration, Technology and Education
  • 洋書

Multimodality in Architecture : Collaboration, Technology and Education  Hardcover

Lee, Ju Hyun (EDT)/ Ostwald, Michael J. (EDT)/ Kim, Mi Jeong (EDT)

  • ウェブストア価格 ¥43,927(本体¥39,934)
  • Springer International Publishing AG(2024/01発売)
  • ポイント 399pt
  • 海外取次在庫