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電子デバイスの埋め込み冷却<br>Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection (Wspc Series in Advanced Integration and Packaging)
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電子デバイスの埋め込み冷却
Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Weibel, Justin A (EDT)/ Asheghi, Mehdi (EDT)

  • ウェブストア価格 ¥32,716（本体¥29,742）
  • World Scientific Publishing Co Pte Ltd（2024/02発売）
  • ポイント 297pt
  • 海外取次在庫
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)
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Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥37,579（本体¥34,163）
  • World Scientific Publishing Co Pte Ltd（2014/10発売）
  • ポイント 341pt
  • 海外取次在庫
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)
  • 洋書

Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥108,317（本体¥98,470）
  • World Scientific Publishing Co Pte Ltd（2014/12発売）
  • ポイント 984pt
  • 海外取次在庫
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