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電子デバイスの埋め込み冷却<br>Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection (Wspc Series in Advanced Integration and Packaging)
  • 洋書

電子デバイスの埋め込み冷却
Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- and Two-phase Convection (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Weibel, Justin A (EDT)/ Asheghi, Mehdi (EDT)

  • ウェブストア価格 ¥30,006（本体¥27,279）
  • World Scientific Publishing Co Pte Ltd（2024/02発売）
  • ポイント 272pt
  • 海外取次在庫
Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)
  • 洋書

Encyclopedia of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 1: Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Encyclopedia of Thermal Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥99,347（本体¥90,316）
  • World Scientific Publishing Co Pte Ltd（2014/12発売）
  • ポイント 903pt
  • 海外取次在庫
Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)
  • 洋書

Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging)  Hardcover,  言語：ENG

Iyengar, Madhusudan (EDT)/ Geisler, Karl J L (EDT)/ Sammakia, Bahgat G (EDT)

  • ウェブストア価格 ¥34,467（本体¥31,334）
  • World Scientific Publishing Co Pte Ltd（2014/10発売）
  • ポイント 313pt
  • 海外取次在庫
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